Solder Lead Waste Reduction of a Selected Mobile Phone Factory: A Six Sigma DMAIC Approach. ITEGAM-JETIA, [S. l.], v. 11, n. 52, p. 173–178, 2025. DOI: 10.5935/jetia.v11i52.1575. Disponível em: https://itegam-jetia.org/journal/index.php/jetia/article/view/1575. Acesso em: 22 oct. 2026.