Solder Lead Waste Reduction of a Selected Mobile Phone Factory: A Six Sigma DMAIC Approach

Autores/as

DOI:

https://doi.org/10.5935/jetia.v11i52.1575

Resumen

Six Sigma is an explicit statistical method of reducing variability and improving processes. Our research works with internal customers within the assembly lines. This study aims to identify and analyze the VOC of internal customers and show improvement based on the VOC. The Six Sigma DMAIC method was followed to conduct this research. Six mobile phone assembly lines were selected to collect wastage data for two months after identifying the problem. Collected data were analyzed in MS Excel, and this analysis showed that the wastage rates were 91.38% in July 2024 and 80.67% in August 2024. The average waste rate was 0.44 g/unit and 0.41 g/unit in July 2024 and August 2024. The root cause analysis, and cause and effect diagram illustrated that most of the reasons behind wastages were related to soldering operators. An awareness and training session was conducted. We collected data for the next month and found the wastage was reduced to 69.27% in September 2024, which is a 24.5% reduction considering August 2024 as the base. The average waste rate was reduced to 0.28 g/unit. The effectiveness of following the Six Sigma method to solve quality or wastage issues is evident hereafter accomplishing this research.

Descargas

Los datos de descarga aún no están disponibles.

Biografía del autor/a

  • Md. Mehedi Hassan Munna, Department of Industrial and Production Engineering Shahjalal University of Science and Technology, Sylhet, Bangladesh

    Department of Industrial and Production Engineering

  • Jonayed Abdullah, Department of Industrial and Production Engineering Shahjalal University of Science and Technology, Sylhet, Bangladesh

    Department of Industrial and Production Engineering

  • Tarequl Islam, Department of Logistics Systems Engineering Bowling Green State University, Ohio, USA.

    Department of Logistics Systems Engineering

  • Most. Anika Tabassum Little, Department of Electrical and Electronic Engineering. Khulna University of Engineering & Technology, Khulna, Bangladesh.

    Department of Electrical and Electronic Engineering

Descargas

Publicado

2025-04-25

Número

Sección

Articles

Cómo citar

Solder Lead Waste Reduction of a Selected Mobile Phone Factory: A Six Sigma DMAIC Approach. (2025). ITEGAM-JETIA, 11(52), 173-178. https://doi.org/10.5935/jetia.v11i52.1575

Artículos más leídos del mismo autor/a